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Immersoin Gold PCB On 4 layer Copper with Blind Via and Green soldermask

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Shenzhen Bicheng Electronics Technology Co., Ltd

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Immersoin Gold PCB On 4 layer Copper with Blind Via and Green soldermask

Name: Immersoin Gold PCB On 4 layer Copper with Blind Via and Green soldermask
Brand: Bicheng Enterprise Limited
Price: 40 USD

Wholesale Immersoin Gold PCB On 4 layer Copper with Blind Via and Green soldermask from china suppliers

Brand Name : Bicheng Enterprise Limited

Model Number : BIC-0046-V4.6

Certification : UL

Place of Origin : China

MOQ : 1

Price : USD 40 -50 per piece

Payment Terms : T/T, Paypal

Supply Ability : 45000 pieces per month

Delivery Time : 5-6 working days

Packaging Details : Vacuum

Glass Epoxy : FR-4, ITEQ IT-180 TG>170°C, er<5.4

Final height of PCB : 1.6mm ±0.16

Final foil external : 1 oz

Final foil internal : 0.5 oz

Surface Finish : Immersion Gold (31.3%) 2 micoinch over 100 microinch nickel

Solder Mask Color : Green

Colour of Component Legend : White

Test : 100% Electrical Test prior shipment

Number of Layers : 4 Layers

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Product profile

1.1 General description

This is a type of 4 layer printed circuit board built on FR-4 substrate with Tg 170°C

for the application of Microcontroller. It's 1.6 mm thick with white silkscreen(Taiyo)

on green solder mask (Nanya) and immersion gold on pads. The base material is

from Taiwan ITEQ supplying 48 up PCB per panel. They're fabricated per IPC

6012 Class 2 using supplied Gerber data. Each 25 panels are packed for

shipment.

1.2 Features and benifits

A. Lead-Free Assembly Compatible
B. Long storage time (It can be stored for more than 1 year in vacuum bag)
C. Impedance control test and solder-ability test
D. Quick CADCAM checking and free PCB quotation
E. Quick Lead time: 3-5 days
F. Free stencil shim sent for new user

1.3 Application

GPRS, VHF Radio, Car Tracking Device, Communication Systems, Electric

Converter, Inverter Solar, PLC Ladder Logic, HSDPA USB Modem, 3G

Wireless Modem, Automobile

1.4 Parameter and data sheet

PCB SIZE	230 x 209mm=48PCS
BOARD TYPE	Multilayer PCB
Number of Layers	4 Layers
Surface Mount Components	YES
Through Hole Components	YES
LAYER STACKUP	copper ------- 17.8um(0.5oz)+plate TOP layer
	Prepreg 7628(43%) 0.195mm
	copper ------- 18um(0.5oz) MidLayer 1
	FR-4 1.0mm
	copper ------- 18um(0.5oz) MidLayer 2
	Prepreg 7628(43%) 0.195mm
	copper ------- 17.8um(0.5oz)+plate BOT Layer
TECHNOLOGY
Minimum Trace and Space:	6.7mil/5.9mil
Minimum / Maximum Holes:	0.3/2.5mm
Number of Different Holes:	13
Number of Drill Holes:	2512
Number of Milled Slots:	144
Number of Internal Cutouts:	0
Impedance Control	no
BOARD MATERIAL
Glass Epoxy:	FR-4, ITEQ IT-180 TG>170°C, er<5.4
Final foil external:	1oz
Final foil internal:	0.5oz
Final height of PCB:	1.6mm ±0.16
PLATING AND COATING
Surface Finish	Immersion Gold (31.3%) 2 micoinch over 100 microinch nickel
Solder Mask Apply To:	Top and Bottom, 12micon Minimum.
Solder Mask Color:	Green, LP-4G G-05, Nanya supplied
Solder Mask Type:	LPSM
CONTOUR/CUTTING	Routing
MARKING
Side of Component Legend	TOP
Colour of Component Legend	White, S-380W, Taiyo Supplied.
Manufacturer Name or Logo:	Marked on the board in a conductor and leged FREE AREA
VIA	Plated Through Hole(PTH), via tented. Blind via from to inner layer 1
FLAMIBILITY RATING	UL 94-V0 Approval MIN.
DIMENSION TOLERANCE
Outline dimension:	0.0059" (0.15mm)
Board plating:	0.0030" (0.076mm)
Drill tolerance:	0.002" (0.05mm)
TEST	100% Electrical Test prior shipment
TYPE OF ARTWORK TO BE SUPPLIED	email file, Gerber RS-274-X, PCBDOC etc
SERVICE AREA	Worldwide, Globally.

Immersoin Gold PCB On 4 layer Copper with Blind Via and Green soldermask

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Immersoin Gold PCB On 4 layer Copper with Blind Via and Green soldermask

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